Real Time X-Ray is conducted at ATRONA on relatively small components. It is typically used for the electronics industry where switch and sensor examination and testing is needed. With the increased use of BGA, Flup-Chip, and Leadless devices, circuit assemblers need something other than traditional x-ray to screen for defects. We can offer real time detection of open circuits, insufficient solder, voids, wire breakage, and other defects.
TECHNOLOGY: Let us take a look at the sample or assembly that you need help with and we can investigate to see if we can offer insight. We use our real time x-ray machine for failure analysis along with depackaging or decapsulating of samples to reveal the internal wiring and soldering / joining for further inspection.
BENEFITS: Real Time X-Ray can provide internal inspection of a sample while moving, rotating, and tilting the sample at the micron level. With Real Time X-Ray, ATRONA offers the microelectronic, semiconductor and PCBA industries the capability for internal inspection of the smallest devices and packages at relatively high magnification and resolution. We can even send you a video of 360 degrees of the component for you to view at your PC and take photos of the regions of interest.
DEPACKAGING / DEPOTTING / DECABSULATING AND X-RAY:
For Switch and Sensor and Micro-Electronics. We perform real time x-ray and failure analysis including full depackaging and analysis.